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All (6)
AR/VR (30)
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Healthcare & Life Sciences (26)
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Lighting (35)
Optical communication (6)
Optical instrumentation (15)
Other (3)
Packaging (4)
Security & Branding (7)
Solar, Energy & Daylight (9)
Transportation (6)
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Equipment (9)
Product (6)
Service (25)
Manufacturing Pillar
R2P (14)
R2R (23)
Wafer-scale (23)
[Organisation Status]
Technology
ASSEMBLY
High mix assembly (Packaged die) (1)
Lamination (3)
Low mix assembly (SMD, bare die, foils) (2)
Other (1)
DICING
Laser (1)
Other (3)
INSPECTION
Electrical testing (2)
Mechanical testing (1)
Optical inspection (4)
Other (1)
Reliability testing (2)
LAYER DEPOSITION
Magnetron Sputtering (4)
Other (4)
Vacuum Evaporation (1)
OPTICAL ELEMENTS
Diamond Micro Machining (1)
Dry Etching (7)
Grayscale Photolithography - Mask (2)
Grayscale Photolithography - Maskless (3)
Laser Ablation (2)
Laser Micromachining (4)
Photolitho (4)
Thermal Reflow (4)
Wet Etching (2)
REPLICATION
Master Scale-up (6)
UV-NIL replication (12)
SERVICES
Chip to wafer bonding (1)
Design check for manufacturability (3)
SOFTWARE SOLUTIONS
CAD related software solutions (2)
Characterization: acquisition, handling, processing, analysis of metrological data (2)
Optical Design and Simulations (3)
STRUCTURAL ELECTRONICS
In-Moulding (1)
Post-process. cutting, slitting, laser (2)
Thermoforming (1)
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